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1. general description the 74hc30; 74hct30 are high-speed si-gat e cmos devices that comply with jedec standard no. 7a. they are pin compatible with low-power schottky ttl (lsttl). the 74hc30; 74hct30 provides a quad 8-input nand function. 2. features and benefits ? input levels: ? for 74hc30: cmos level ? for 74hct30: ttl level ? esd protection: ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v ? multiple package options ? specified from ? 40 c to +85 c and from ? 40 c to +125 c 3. ordering information 74hc30; 74hct30 8-input nand gate rev. 04 ? 4 may 2010 product data sheet table 1. ordering information type number package temperature range name description version 74hc30n ? 40 c to +125 c dip14 plastic dual in-line package; 14 leads (300 mil) sot27-1 74hct30n 74hc30d ? 40 c to +125 c so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 74HCT30D 74hc30db ? 40 c to +125 c ssop14 plastic shrink small outline package; 14 leads; body width 5.3 mm sot337-1 74HCT30Db 74hc30pw ? 40 c to +125 c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 74hct30pw
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 2 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 4. functional diagram fig 1. logic symbol fig 2. iec logic symbol mna488 a y 1 8 b 2 c 3 d 4 e 5 f 6 g 11 h 12 8 & mna489 1 2 3 4 5 6 11 12 fig 3. logic diagram b a c d f e g h mna49 0 y
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 3 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 5. pinning information 5.1 pinning 5.2 pin description fig 4. pin configuration dip14, so14 and (t)ssop14 74hc30 74hct30 av cc b n.c. ch dg e n.c. f n.c. gnd y 001aal790 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 2. pin description symbol pin description a 1 data input b 2 data input c 3 data input d 4 data input e 5 data input f 6 data input gnd 7 ground (0 v) y 8 data output n.c. 9 not connected n.c. 10 not connected g 11 data input h 12 data input n.c. 13 not connected v cc 14 supply voltage
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 4 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 6. functional description [1] h = high voltage level; l = low voltage level; x = don?t care. 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for dip14 package: p tot derates linearly with 12 mw/k above 70 c. for so14 package: p tot derates linearly with 8 mw/k above 70 c. for (t)ssop14 packages: p tot derates linearly with 5.5 mw/k above 60 c. table 3. function table [1] input output a b c d e f g h y l xxxxxxxh xl xxxxxxh xxl xxxxxh xxxl xxxxh xxxxl xxxh xxxxxl xxh xxxxxxl xh xxxxxxxl h hhhhhhhhl table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7 v i ik input clamping current v i < ? 0.5 v or v i >v cc +0.5 v [1] - 20 ma i ok output clamping current v o < ? 0.5 v or v o >v cc +0.5v [1] - 20 ma i o output current ? 0.5 v < v o < v cc +0.5v - 25 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 c p tot total power dissipation dip14 package [2] - 750 mw so14, (t)ssop14 packages [2] - 500 mw
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 5 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 8. recommended operating conditions 9. static characteristics table 5. recommended operating conditions voltages are referenced to gnd (ground = 0 v) symbol parameter conditions 74hc30 74hct30 unit min typ max min typ max v cc supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 v v i input voltage 0 - v cc 0-v cc v v o output voltage 0 - v cc 0-v cc v t amb ambient temperature ? 40 - +125 ? 40 - +125 c t/ v input transition rise and fall rate v cc = 2.0 v - - 625 - - - ns/v v cc = 4.5 v - 1.67 139 - 1.67 139 ns/v v cc = 6.0 v - - 83 - - - ns/v table 6. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max 74hc30 v ih high-level input voltage v cc = 2.0 v 1.5 1.2 - 1.5 - 1.5 - v v cc = 4.5 v 3.15 2.4 - 3.15 - 3.15 - v v cc = 6.0 v 4.2 3.2 - 4.2 - 4.2 - v v il low-level input voltage v cc = 2.0 v - 0.8 0.5 - 0.5 - 0.5 v v cc = 4.5 v - 2.1 1.35 - 1.35 - 1.35 v v cc = 6.0 v - 2.8 1.8 - 1.8 - 1.8 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 2.0 v 1.9 2.0 - 1.9 - 1.9 - v i o = ? 20 a; v cc = 4.5 v 4.4 4.5 - 4.4 - 4.4 - v i o = ? 20 a; v cc = 6.0 v 5.9 6.0 - 5.9 - 5.9 - v i o = ? 4.0 ma; v cc = 4.5 v 3.98 4.32 - 3.84 - 3.7 - v i o = ? 5.2 ma; v cc = 6.0 v 5.48 5.81 - 5.34 - 5.2 - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 2.0 v - 0 0.1 - 0.1 - 0.1 v i o = 20 a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o = 20 a; v cc = 6.0 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 4.5 v - 0.15 0.26 - 0.33 - 0.4 v i o = 5.2 ma; v cc = 6.0 v - 0.16 0.26 - 0.33 - 0.4 v i i input leakage current v i = v cc or gnd; v cc =6.0v -- 0.1 - 1- 1 a i cc supply current v i = v cc or gnd; i o =0a; v cc =6.0v --2.0- 20 - 40 a
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 6 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 10. dynamic characteristics c i input capacitance -3.5- - - - -pf 74hct30 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 1.6 - 2.0 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - 1.2 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = ? 20 a 4.4 4.5 - 4.4 - 4.4 - v i o = ? 4.0 ma 3.98 4.32 - 3.84 - 3.7 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 20 a - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma - 0.15 0.26 - 0.33 - 0.4 v i i input leakage current v i = v cc or gnd; v cc =5.5v -- 0.1 - 1- 1 a i cc supply current v i = v cc or gnd; i o =0a; v cc =5.5v --2.0- 20 - 40 a i cc additional supply current per input pin; v i =v cc ? 2.4 v; i o =0a; other inputs at v cc or gnd; v cc = 4.5 v to 5.5 v - 60 216 - 275 - 294 a c i input capacitance -3.5- - - - -pf table 6. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max table 7. dynamic characteristics gnd = 0 v; c l = 50 pf; for load circuit see figure 6 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ max max (85 c) max (125 c) 74hc30 t pd propagation delay a, b, c, d, e, f, g, h to y; see figure 5 [1] v cc = 2.0 v - 41 130 165 195 ns v cc = 4.5 v - 15 26 33 39 ns v cc = 5.0 v; c l =15pf - 12 - - - ns v cc = 6.0 v - 12 22 28 33 ns t t transition time see figure 5 [2] v cc = 2.0 v - 19 75 95 110 ns v cc = 4.5 v - 7 15 19 22 ns v cc = 6.0 v - 6 13 16 19 ns
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 7 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate [1] t pd is the same as t phl and t plh . [2] t t is the same as t thl and t tlh . [3] c pd is used to determine the dynamic power dissipation (p d in w): p d =c pd v cc 2 f i n+ (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; (c l v cc 2 f o ) = sum of outputs. 11. waveforms c pd power dissipation capacitance per package; v i =gndtov cc [3] -15- - -pf 74hct30 t pd propagation delay a, b, c, d, e, f, g, h to y; see figure 5 [1] v cc = 4.5 v - 16 28 35 42 ns v cc = 5.0 v; c l =15pf - 12 - - - ns t t transition time v cc = 4.5 v; see figure 5 [2] - 7 15 19 22 ns c pd power dissipation capacitance per package; v i =gndtov cc ? 1.5 v [3] -15- - -pf table 7. dynamic characteristics ?continued gnd = 0 v; c l = 50 pf; for load circuit see figure 6 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ max max (85 c) max (125 c) measurement points are given in table 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 5. input to output propagation delays 001aal7 92 v ol v oh gnd v m t phl t plh t thl t tlh v m v x v y ny output a, b, c, d, e, f, g, h input v i table 8. measurement points type input output v m v m v x v y 74hc30 0.5v cc 0.5v cc 0.1v cc 0.9v cc 74hct30 1.3 v 1.3 v 0.1v cc 0.9v cc
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 8 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate test data is given in table 9 . definitions for test circuit: r t = termination resistance should be equal to the output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. fig 6. test circuit for measuring switching times 001aah7 68 t w t w t r t r t f v m v i negative pulse gnd v i positive pulse gnd 10 % 90 % 90 % 10 % v m v m v m t f v cc dut r t v i v o c l g table 9. test data type input load test v i t r , t f c l 74hc30 v cc 6.0 ns 15 pf, 50 pf t plh , t phl 74hct30 3.0 v 6.0 ns 15 pf, 50 pf t plh , t phl
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 9 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 12. package outline fig 7. package outline sot27-1 (dip14) unit a max. 1 2 (1) (1) b 1 cd (1) z ee m h l references outline version european projection issue date iec jedec jeita mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot27-1 99-12-27 03-02-13 a min. a max. b max. w m e e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.087 0.17 0.02 0.13 050g04 mo-001 sc-501-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 14 1 8 7 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. dip14: plastic dual in-line package; 14 leads (300 mil) sot27 -1
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 10 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate fig 8. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale s o14: plastic small outline package; 14 leads; body width 3.9 mm sot108 -1
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 11 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate fig 9. package outline sot337-1 (ssop14) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 0.2 7.9 7.6 1.03 0.63 0.9 0.7 1.4 0.9 8 0 o o 0.13 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot337-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 7 14 8 a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop14: plastic shrink small outline package; 14 leads; body width 5.3 mm sot337 -1 a max. 2
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 12 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate fig 10. package outline sot402-1 (tssop14) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 17 14 8 a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402 -1 a max. 1.1 pin 1 index
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 13 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 13. abbreviations 14. revision history table 10. abbreviations acronym description cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model lsttl low-power schottky transistor-transistor logic mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74hc_hct30_4 20100504 product data sheet - 74hc_hct30_3 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. 74hc_hct30_3 20100420 product data sheet - 74hc_hct30_2 74hc_hct30_2 19970829 produ ct specification - -
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 14 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
74hc_hct30_4 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 04 ? 4 may 2010 15 of 16 nxp semiconductors 74hc30; 74hct30 8-input nand gate export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74hc30; 74hct30 8-input nand gate ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 4 may 2010 document identifier: 74hc_hct30_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 contact information. . . . . . . . . . . . . . . . . . . . . 15 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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